Honglei Optics Wins Batch Orders for TGV Glass Substrate Direct-Write Lithography Equipment

Hongtian Co., Ltd. recently secured bulk procurement orders for its subsidiary Honglei Optics in the field of glass substrate direct-write lithography. According to the company, its self-developed TGV glass substrate direct-write lithography equipment has been delivered, and direct-write lithography equipment for semiconductor photomask applications has also been shipped to customers.

This batch signing marks Honglei Optics' breakthrough in glass substrate direct-write lithography from "first mover" to "bulk orders."

Honglei Optics is a controlled subsidiary of Hongtian Co., Ltd., focusing on three application areas: PCB HDI/FPC high-end circuit boards, semiconductor glass substrates (TGV), and advanced packaging photomasks. It has established R&D centers in Shenzhen and Shanghai. According to the company, all three of its micro/nano direct-write lithography equipment models have received orders from leading industry customers.

The underlying driver of this market breakthrough is the replacement of traditional organic substrates by glass substrates in advanced packaging. With high-performance application scenarios such as AI computing chip packaging, CPO optical modules, and Micro LED rapidly expanding, the wiring density and warpage resistance of traditional organic substrates are approaching their limits.

Industry experts say glass substrates based on TGV technology offer advantages such as low electrical loss, high flatness, and warpage resistance, making them suitable for next-generation packaging scenarios such as Chiplet heterogeneous integration and optoelectronic co-packaging. They are a key material supporting the continued upgrade of AI computing power.

Signal transmission loss of glass substrates at 10GHz is only 0.3dB/mm, with dielectric loss more than 50% lower than traditional organic substrates. TGV technology achieves vertical interconnection between upper and lower structures by fabricating large numbers of micron-scale through-holes in the glass material and filling them with metal, significantly shortening signal transmission paths and increasing interconnect density.

In terms of industry pace, multiple industry experts tend to view 2026 as a "critical validation period" for glass substrates rather than the year of full-scale mass production. China's TGV glass substrate sector is approaching a critical juncture in the transition from technology validation to small-batch production.

The industry chain generally expects that it will take another two to three years to mature key processes, with the first commercialization phase likely around 2028. Honglei Optics' delivery of bulk orders at this stage provides initial validation of its technology solution's mass production adaptability at the customer end.

As the TGV process chain continues to mature and demand for AI computing chip packaging continues to be released, the bulk deployment of domestic direct-write lithography equipment in this emerging sector means that the domestic supply chain for key advanced packaging equipment is gradually entering the industrialization introduction stage.

Whether Honglei Optics can convert its first-mover advantage into sustained production capacity delivery and process iteration capabilities will be the key variable in maintaining its competitiveness in this sector. OFweek Optics will continue to monitor its subsequent market progress.