TRUMPF to Showcase TruMicro UV Femtosecond Lasers for Wafer Dicing and Advanced Packaging at Wesemibay

(Shanghai, China, October 9, 2026) TRUMPF, a global leading provider of machine tool and laser technology solutions, will showcase its ultrafast laser technology from the TruMicro series and related applications at Wesemibay 2026 (October 14-16, Hall 1, Booth 1G12). The company will also share its strengths in ultraviolet femtosecond lasers, energy output control and scalable technology platforms. The product family has already been adopted in volume production by leading display panel and semiconductor manufacturers. TRUMPF's expertise in ultrashort pulse lasers has long been recognized: its ultrashort pulse laser technology received the German Future Award, and its capabilities span the entire path from frontier research to volume manufacturing.

Flagship product: TruMicro 6320 UV femtosecond laser built for volume production

The TRUMPF TruMicro 6320 is a UV femtosecond laser designed for continuous, around-the-clock production. Its stable high-power output, ultrashort pulse width and leading-edge UV frequency-doubling technology minimize thermal effects and enable chipping-free processing. It is particularly suited to precision dicing of wafer surfaces and precision cutting of advanced packaging materials, significantly boosting throughput and yield.

Figure 1: TRUMPF TruMicro 6320 UV femtosecond laser

Core technology: intelligent energy output control and precise beam shaping

TRUMPF's laser TGV process uses ultrashort pulse lasers to modify the interior of the glass, followed by selective etching. This achieves microvias as small as 10 micrometers and high-precision through-vias at densities of up to 8 million per panel, with the consistency required for volume production. Compared with silicon interposers, glass substrates offer lower signal loss, greater stability and lower cost, particularly in panel-level applications. "Glass substrates open up new material and process options for panel-level advanced packaging. It is our laser technology that makes such large-scale glass production possible."

Figure 2: TGV glass through-hole technology

Strong support: a scalable platform

The TruMicro series covers multiple advanced laser technology platforms, including fiber, disk, and slab amplification, offering high scalability to respond quickly to evolving market and customer application needs. TRUMPF also offers a range of wavelength conversion modules: frequency-doubling modules can convert infrared femtosecond pulses into green, ultraviolet, and even deep ultraviolet light; combined with pulse compression and high-harmonic generation (HHG) modules, they can also produce the required wavelengths for cutting-edge applications such as wafer inspection and photomask inspection.

Figure 3: Wafer

About TRUMPF

TRUMPF is a high-tech company offering manufacturing solutions for the machine tool, laser technology, and semiconductor industries. The company drives the digitalization and connectivity of manufacturing through consulting, platform products, and software. TRUMPF is one of the technology and market leaders in machine tools for flexible sheet metal processing, as well as industrial lasers and electronic power supplies.

In fiscal year 2025/26, TRUMPF employed 16,960 people and generated sales of EUR 4.3 billion (preliminary figures). The TRUMPF Group comprises around 90 companies and operates in nearly all European countries as well as in North and South America and Asia. Production sites are located in Germany, France, the United Kingdom, Italy, Austria, Switzerland, Poland, the Czech Republic, the United States, Mexico and China.